TLS present at the ISTA TransPack Forum 2024 in San Diego, California

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TECHLAB SYSTEMS is proud to announce its participation in the prestigious TransPack Forum 2024 event, organized by ISTA – International Safe Transit Association. The event will take place from April 22 to 24, 2024 at the prestigious Marriott Marquis San Diego Marina, in the United States.

As a featured sponsor of TransPack Forum 2024 , TECHLAB SYSTEMS, through its TLS brand, joins an outstanding roster of packaging and supply chain industry experts and leaders to share knowledge, discuss emerging trends and explore innovative solutions that drive the future of the sector.

During the three days of the event, a series of technical presentations will be carried out by relevant personnel in the world of packaging and supply chain. These presentations will offer a unique platform to discuss current and future challenges facing the industry, as well as to highlight the latest innovations and best practices.

The TECHLAB SYSTEMS team will be present to actively participate in these technical presentations, sharing their experience and perspectives on how technology can drive efficiency, sustainability and quality in packaging and the supply chain.

“We are delighted to participate in the ISTA TransPack Forum 2024 and have the opportunity to interact with colleagues from around the world who share our commitment to innovation and excellence in packaging,” said Ernie Watts, Head of US Sales at TLS. . “We look forward to contributing to the discussions and learning from the experiences of other industry leaders.”

In addition to technical presentations, the event will also include networking sessions, product and service showcases, and networking opportunities with industry professionals.

TECHLAB SYSTEMS invites everyone interested in discovering the latest innovations in packaging technology to join us at the TransPack Forum 2024. For more information about the event and to register, visit the official TransPack Forum website (


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