We are thrilled to share the exciting news that TECHLAB SYSTEMS will actively participate in the international exhibition ANDINA PACK 2023, that will take place at Bogota, Colombia from 27 to 30 November 2023.
ANDINA PACK is the most important business fair in the Andean region, focused on production, processing, packing, packaging and handling technologies for the food, beverage, cosmetics and pharmaceutical industries.
We invite you to visit the Stand 343 – Pabellón 3 of our colombian representative LANZETTA RENGIFO and explore the latest innovations we have developed in the field of analysis and testing of packaging. We will be showcasing various testing equipment, including our Universal Testing Machine MTE-1 model which specializes in conducting various tensile and friction tests in several material, providing accurate and efficient results.
Additionally, we will introduce our Samples Crush Tester CDM-5 model, designed for performing paper and corrugated cardboard strength tests, such as the ECT (Edge Crush Test), one of the most important corrugated board characterization tests.
Our experts team will be present at the Stand 343 – Hall 3 to provide detailed demonstrations of the equipment, answer specific questions, and engage in discussions about the practical applications of our solutions.
We look forward to welcoming you at ANDINA PACK 2023 with enthusiasm!